Kenneth E. Goodson

Professor
Faculty of Thermosciences Division, Department of Mechanical Engineering

Degrees

B.S. MIT --Mechanical Engineering (1989)
B.S. MIT -- Humanities (1989)
M.S. MIT -- Mechanical Engineering (1991)
Ph.D. MIT -- Mechanical Engineering (1993)

Research Interests

His group studies thermal transport phenomena with very small length and
time scales, in particular those relevant for the design of transistors,
semiconductor lasers, and MEMS. A number of his students are working on
two-phase microchannel and micro-jet impingement cooling technology for
semiconductor chips. His group also studies the applications of MEMS
technology for biomedical diagnostics, thermal machining, and infrared
imaging.

Goodson Research Group

Goodson Research Group Laboratories

• Microscale Thermal and Mechanical Characterization Laboratory (MTMC)
• Microscale Thermosciences Teaching Laboratory (MTTL)

Awards/Honors

Best Paper Award, SEMI-THERM 2001
NSF CAREER Award, 1996-2000
ONR Young Investigator Award, 1996-1999
Outstanding Reviewer, ASME Journal of Heat Transfer, 1999
Outstanding Paper Award, Multilevel Interconnect Symposium, 1998
JSPS Visiting Professor, Tokyo Institute of Technology, 1996

Selected Publications

(complete list of publications)

 

Pop, E., Sinha, S., and Goodson, K.E., 2005, “Heat Generation and Transport in Nanometer Scale Transistors,” Proceedings of the IEEE, in press .

McConnell, A.D., and Goodson, K.E., 2005, “Thermal Conduction in Silicon Micro and Nanostructures,” Annual Review of Heat Transfer , Vol. 14, pp. 129-168.

Koo, J.M., Im, S., Jiang, L., and Goodson, K.E., 2005, “Integrated Microchannel Cooling for Three-Dimensional Circuit Architectures,” ASME Journal of Heat Transfer , Vol. 127, pp. 49-58.

Im, S., Srivastava, N., Banerjee, K., and Goodson, K.E., 2005, “Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs,” IEEE Transactions on Electron Devices, Vol. 52, pp. 2710-2719.

Sinha, S., Shelling, P.K., Phillpot, S.R., Goodson, K.E., 2005, “Scattering of g-Process Longitudinal Phonons at Hotspots in Silicon,” Journal of Applied Physics , Vol. 97, no.2, pp. 023702-1-023702-9.

Pop, E., Dutton, B., and Goodson, K.E., 2004, “Analytic Band Monte Carlo Model for Electron Transport Modeling in Si Including Acoustic and Optical Phonon Dispersion,” Journal of Applied Physics , Vol. 96, pp. 4998-5005.

Fletcher, D.A., Crozier, K.B., Guarini, K.W., Minne, S.C., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, "Microfabricated Silicon Solid Immersion Lens," IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 10, pp. 450-459.

Jain, A., Ness, K.D., Mehenti, N.Z., Fishman, H.A., and Goodson, K.E., 2005, “A microheater device for study of temperature gradient effects on neurite outgrowth in retinal ganglion cells,” Investigative Opthalmology and Visual Science , Vol. 45, p. U401.

Jiang, L., Mikkelsen, J., Koo, J.-M., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J., Prasher, R., Santiago, J.G., Kenny, T.W. Goodson, K.E., 2001, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proceedings on Components, Packaging, and Manufacturing Technology, Vol. 25, No. 3, pp. 347-355, 2002.

Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

Sponsored research projects

National Science Foundation, NIRT: “Properties of Deformed Carbon Nanotubes:  Thermal Characterization of SWCNT Structures”

ONR, “Convection Performance of Nanofluids for Electronics Cooling”

SRC, " Modeling and Diagnostics of Coupled Thermal and Thermomechanical Phenomena at Packaging Interfaces”

SRC, “ Self-Consistent Monte Carlo and Quantum/Atomistic Electrothermal
Simulation of Nanotransistors”

Intel, " Two-Phase Microchannel Cooling:  Hotspot Reduction, Simulation Tool Development, and Experimental Verification "

Intel, “Electroluminescence Thermometry of Nanotransistors”

Intel, “Modeling of Phase Change Memory Devices”

Honda, " Two-Phase Microchannel Transport in Fuel Cells: Experiments, Compact  Models, and Simulation "

MARCO, " Focus Research Center for Interconnections for Gigascale Integration: Thermofluidic Power and Cooling Modules for Electronic Systems "

DARPA, “Thermal Engineering of 3D Integrated Circuits”

DARPA, " Encapsulated MEMS:  Thermal Dissipation Mechanisms "

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